ANALYSIS AND OPTIMIZATION DESIGN OF SIGNAL INTEGRITY IN OPTOELECTRONIC INTEGRATED SYSTEMS

Abstract

With the rapid development of high-speed communications, artificial intelligence computing, data centers, and advanced packaging technologies, optoelectronic integrated systems have shown great potential for high-bandwidth, low-power, and high-density interconnect applications. However, in practical systems, high-speed electrical signals still propagate through packaging interconnects, differential transmission lines, pads, vias, and electro-optic modulator interfaces, where they are susceptible to impedance discontinuity, insertion loss, signal reflection, crosstalk, and bandwidth limitation. These impairments can degrade the electrical eye diagram and further reduce the optical modulation quality. This paper investigates signal integrity issues in optoelectronic integrated systems by analyzing the main degradation mechanisms along the high-speed electrical interconnect path and at the electro-optic conversion interface. Optimization strategies are discussed from the perspectives of impedance matching, interconnect structure optimization, crosstalk suppression, and driver–modulator co-design. The results indicate that system-level signal integrity optimization can effectively reduce high-frequency loss and reflection, improve eye opening, and enhance the effective driving voltage at the modulator input as well as the optical output quality. This work provides useful guidance for the design of high-bandwidth, low-power, and highly reliable optoelectronic integrated systems.